Accretech / TSK HRG 200 X Grinder

Asset # : 78826
Equipment Make: Accretech / TSK
Equipment Model: HRG 200 X
Type: Grinder
Wafer Size:
Equipment Configuration: - It is used for 6inch SiC
Includes;
- Auto Wafer Load Unit
- Spindle: 6.3kW (2)
- Rough GW: #2000
- Fine GW: #8000
- Dressing Board For #2000 Fine WG
- Dressing Board For #8000 Fine WG
- Vacuum Pump
- H1 Standard Arm For 6"
- Standard Chuck Table For 6
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  • Added: April 23, 2024

  • Views: 245

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