Orthodyne M 360 C Bonder
Asset # :
64870
Equipment Make:
Orthodyne
Equipment Model:
M 360 C
Type:
Bonder
Wafer Size:
Equipment Configuration:
Missing:
– Data monitor
– Theta motor, flags, and misc. mounting parts
– Bond head
– CPU board, PR board, and IO interface boards
Equipment Pictures:
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Added: April 11, 2022
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Views: 78