Orthodyne M 360 C Bonder

Asset # : 64870
Equipment Make: Orthodyne
Equipment Model: M 360 C
Type: Bonder
Wafer Size:
Equipment Configuration:

Missing:
– Data monitor
– Theta motor, flags, and misc. mounting parts
– Bond head
– CPU board, PR board, and IO interface boards

Equipment Pictures:

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  • Added: April 11, 2022

  • Views: 21

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