Datacon / Besi 2200 EVO Multichip Die Bonder

Asset # : 62430
Equipment Make: Datacon / Besi
Equipment Model: 2200 EVO
Type: Multichip Die Bonder
Wafer Size:
Equipment Configuration:

– Dual head
– Bond head (Heated 155 C)
– Substrate Camera
– Uhura Camera
– Uplooking Camera
– Wafer Camera
– Substrate and Wafer Reader
– Ejection Tool
– Bond Force Reader
– Wafer Table
– Wafer Lift
– Bond Zone
– Loader Unloader Buffer Track

Equipment Pictures:

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Ad Details

  • Added: December 7, 2021

  • Views: 99

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