Datacon 2200 EVO Die Bonder

Asset # : 61609
Equipment Make: Datacon
Equipment Model: 2200 EVO
Type: Die Bonder
Wafer Size:
Equipment Configuration:

Single Head, Squeegee Unit, Dispenser Holder
Equipment Pictures:
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Datacon 2200 EVO Die Bonder 61609

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Datacon 2200 EVO Die Bonder 61609 Image 7

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  • Added: October 14, 2021

  • Views: 677

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