Disco DFL 7160 Wafer Dicing Saw

Asset # : 60979
Equipment Make: Disco
Equipment Model: DFL 7160
Type: Wafer Dicing Saw
Wafer Size:
Equipment Configuration:

– Laser Maximum Power: 18 W
– Laser Wavelength: 355 nm
– 50/60Hz, 3 Phase, 14amps

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  • Added: August 23, 2021

  • Views: 89

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