Disco DFL 7160 Wafer Dicing Saw
Asset # :
60979
Equipment Make:
Disco
Equipment Model:
DFL 7160
Type:
Wafer Dicing Saw
Wafer Size:
Equipment Configuration:
- Laser Maximum Power: 18 W
- Laser Wavelength: 355 nm
- 50/60Hz, 3 Phase, 14amps
Missing parts:
- Laser head
- Chiller
- Vacuum pump
- Hogomax pump system
- Process point power meter
- Laser power supply
- Laser Wavelength: 355 nm
- 50/60Hz, 3 Phase, 14amps
Missing parts:
- Laser head
- Chiller
- Vacuum pump
- Hogomax pump system
- Process point power meter
- Laser power supply
Equipment Pictures:
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Added: August 23, 2021
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Views: 272