Disco DFL 7340 Laser Saw

Asset # : 60162
Equipment Make: Disco
Equipment Model: DFL 7340
Type: Laser Saw
Wafer Size:
Equipment Configuration:

– Processing method: Stealth dicing
– Workpiece size: φ8″
X-axis (Chuck table)
– Processing range: 210mm
– Max. processing speed: 1 – 1,000mm/sec
Y-axis (Chuck table)
– Processing range: 210mm
– Index step: 0.0001mm
– Positioning accuracy: 0.003/310mm (Si
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Ad Details

  • Added: June 24, 2021

  • Views: 190

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