Datacon 2200 APM+ Die Bonder
Asset # :
56938
Equipment Make:
Datacon
Equipment Model:
2200 APM+
Type:
Die Bonder
Wafer Size:
Equipment Configuration:
Standard Machine (single module):
Pickup Tool Changer module
Ejector Tool system
12″ Wafer Handling system
Flat Belt transport system
Substrate looking camera
Upward looking camera
Dispenser types: Time Pressure
Fluxer system
Flip Chip module
Equipment Pictures:
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Added: October 9, 2020
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Views: 351