Datacon 2200 APM+ Die Bonder

Asset # : 56938
Equipment Make: Datacon
Equipment Model: 2200 APM+
Type: Die Bonder
Wafer Size:
Equipment Configuration:

Standard Machine (single module):
Pickup Tool Changer module
Ejector Tool system
12″ Wafer Handling system
Flat Belt transport system
Substrate looking camera
Upward looking camera
Dispenser types: Time Pressure
Fluxer system
Flip Chip module

Equipment Pictures:

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Ad Details

  • Added: October 9, 2020

  • Views: 199

Description

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