Hughes / Palomar 6500 Die Bonder

Asset # : 56530
Equipment Make: Hughes / Palomar
Equipment Model: 6500
Type: Die Bonder
Wafer Size:
Equipment Configuration:

– High-precision component Placement system
– Includes option for picking up solder preforms from waffle pack
– System was designed to attach a diode laser to a chip that had 80/20 solder sputtered on the bonding location. Placement of the laser within +/- 3 microns accuracy

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  • Added: October 9, 2020

  • Views: 90

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