Siemens / ASM Siplace CA 4 Chip Assembly and Placement

Asset # : 56121
Equipment Make: Siemens / ASM
Equipment Model: Siplace CA 4
Type: Chip Assembly and Placement
Wafer Size: 8"
Equipment Configuration:

– 4 Siplace Wafer Systems including 8″ wafer expansion
– 4 Portal microchip / SMD Hybrid Assembly system
– 4 Wafer Transfer Systems
– LP-Kamera (TYP 34) and bonding Head C + P 20
– Vakuum Tooling Single transport Chuck
– Chiller Cooling System
– Vacuum pump X-Series

Equipment Pictures:

Send BTG Message:

Inquire

Ad Details

  • Added: October 9, 2020

  • Views: 203

Description

Tags :