Siemens / ASM Siplace CA 4 Chip Assembly and Placement

Asset # : 56121

Equipment Make: Siemens / ASM

Equipment Model: Siplace CA 4

Type: Chip Assembly and Placement

Wafer Size: 8"

Equipment Configuration:

– 4 Siplace Wafer Systems including 8″ wafer expansion
– 4 Portal microchip / SMD Hybrid Assembly system
– 4 Wafer Transfer Systems
– LP-Kamera (TYP 34) and bonding Head C + P 20
– Vakuum Tooling Single transport Chuck
– Chiller Cooling System
– Vacuum pu

Equipment Pictures: