Applied Materials Centura TPCC RTP XE+–Sold

Asset # : 56038
Equipment Make: Applied Materials
Equipment Model: Centura TPCC RTP XE+
Type:
Wafer Size:
Equipment Configuration:

– Software version: B6.50
– CIM: Linked
– SMIF: Asyst LPT 2200 (qty. 2)
– Handler: HP robot with single contact quartz blade
– Process Chms: XE+ process chamber (Chm A, B & C)
– Loadlock Pump (AA20)
– SMC Chiller (IRN-498)
– Wafer Mapping Mode: FWM
– Robot Speed: 30000 / 60000
– Rotation Speed: 90 / 20
– Standby Online Pressure (Torr): 780
– LLA & LLB Manometer Type (Torr): 1000 & 1000
– Process Chm Manometer Type (Torr): 1000
– Pressure Control Mode: PID
– O2 Analyzer: Ametek CG1100
– Ebara Pump AA20N
– Pump Cooling H2O: 6.0
Millipore 2900 Series Process Gas:
– N2-Purge / 10SLPM / NO
– O2-Big / 10SLPM / NC
– O2-Smal / 1SLPM / NC
– N2-Process / 20SLPM / NC
– NH3 / 10SLPM / NC
– Bottom Purge – N2 / 20SLPM / NC

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  • Added: October 9, 2020

  • Views: 342

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