Asset # : 48250
Equipment Make: Accretech / TSK
Equipment Model: UF 200
Type: Prober
Wafer Size:
Equipment Configuration:

– Standard UF 200 upgraded to UF 200 A
– Sealed and used for automotive probing (-40° C to 140° C)
– ATT Chuck System
– Att Hot-/Coolchuck and Dry Air Kit
– Sealing for low temperature probing at -40° C
– 2nd Cassette table
– SD-Card Drive replaced Floppy drive
– Thin Wafer Handling preparation
– Headplate opening for 51 cm Probecard Ring outer diameter
– Remote Terminal (Optional, for additional cost)
– Wafer ID Reader WID 110 (Optional, for additional cost)
– Huber Chiller Unistat 705 (Optional, for additional cost)

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  • Added: July 8, 2019

  • Views: 212

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