Finetech Fineplacer Flip Chip Bonder Sold

Asset # : 47089
Equipment Make: Finetech
Equipment Model: Fineplacer
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration:
Equipment Pictures:

Send BTG Message:

Inquire

Ad Details

  • Added: April 24, 2019

  • Views: 1516

Description

Tags :