Lam Rainbow 4428 XL Poly Nitride Etcher

Includes:
– Software Version E1.5.1
– Main Chamber:
ESC
Bias RF Match
RF Generator: 1250W
MFC 1 (Gas Type / Size sccm): CL2 / 500
MFC 2: HBR / 50
MFC 3: O2 / 15
MFC 4: CHF3 / 50
MFC 5: HE 500 / 500
MFC 6: SF6 / 200
MFC 7: HE 50/50
MFC 8: CF4 / 200
Transport
– Integrated SMIF (2)
– Wafer Notch Aligner with Spatula
– Harmonic Arm Drive Assembly
Hardware Parameters
– Gap (type/size): Moved / 15cm
– Bot RF gen power (Watt): 0-1250
– Chamber Temp (Wall) Deg.: 60
– Chamber Temp (Upper Electrode) Deg.: 40
– Chamber Temp (Lower Electrode) Deg.: 40
– Edge Helium Cooling (Pressure, Flow): 0-50 Torr / 0-50 sccm
– Turbo Pump Size (Liters/sec.) / Type: STPH200 C/EBARA
– Rough Pump Type: Ebara
– Non-Critical to Process
– Wafer Chuck Type / Coating Material: ESC
– Focus Ring Thickness (Initial): Focus Ring
– MTBC: 13000MINS
Setup Specification
– PC Particles: Level / Size: 0.1 / >0.16um
– PC Etch Rate (A/min): 1037-1199 / 2750-3050