EVG 520 IS UV NIL Bonder

Asset # : 53001

Equipment Make: EVG

Equipment Model: 520 IS

Type: UV NIL Bonder

Wafer Size: 8"

Equipment Configuration:

– Max Overpressure: 1 Atmosphere for Contactless Pressurization of Pre-Bonded Wafer Pairs
– Max Contact Force Created by One Atmosphere Pressure Differential (<14.5 PSI) - Atmospheric Capabilities down to 1 x 10 -1 mbar (7.5 x 10 -2 Torr) - Pump Time Capa

Equipment Pictures: