CVC 2800 LL Load Lock Dual Process Chamber Sputtering System
- With handler
- System uses two (2) ENI OEM 25 13.56 Mhz solid state RF power units
- Up to 8 process chambers & up to 9 process modules available
Chamber Process Gasses:
- 3 mass flow controllers available
- Argon
- Nitrogen
- Oxygen
Load Lock Chamber:
- Iron Mill, approx. 50 Angstroms per minute
- Has chamber heater
- Operating Temperature: Approx. 250 Degrees Celsius
Process Chamber 1:
- Has 3 targets
- Titanium
- Ti-W (10% wt Titanium to 90% wt Tungsten)
- Nickel
- Has 1 RF power supply
Process Chamber 2
- Has 3 targets
- Aluminum
- Tantalum
- Titanium
- Has 1 RF power supply
System Support Equipment Includes:
- 3 CTI 8 Cryo pumps & compress
- 2 Alcatel M2033 Mechanical Vacuum Pump
Substrate Handing Options:
- 150 mm round substrate pallet capable of holding 8 substrates
- 200 mm round substrate pallet capable of holding 6 substrates
- Customizable 200 mm to 150 adaptable pallet for edge protection