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Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw
Disco DFL 7560 L Laser Saw

Disco DFL 7560 L Laser Saw

Asset #: 76573

Make: Disco

Model: DFL 7560 L

Wafer Sizes: 2, 3, 4 inch

Disco DFL 7560 L Laser Saw, 2" to 4"
- Robot Wafer handling
- Wafer: Can be modified at later date to 3”, 4” & 6” wafers and frame
- Operation by touch panel LCD monitor
- Step-down Transformer 400 V, 3 phases, 50 Hz
- Signal tower
- CE-marking
- Operation and troubleshooting manuals
- Low and High Magnification microscope with LED illumination
- X and Y axis with linear scale closed loop control
- Laser power supply with built in water cooled chillers
- Chiller unit to supply cooling water for Laser power supply
- Chiller unit to supply cooling water to X axis
- Z axis positional repeatability 0.002mm Options: 1
- Uninterruptible Power Supply: 1
Machine modification includes:
- 200mm Fully Automatic wafer handling from/to standard wafer cassette
- Chuck for 200mm wafers
- New robot design for handling heavier wafers
- New CE marking 6 inch Lens and new Galvo Scanner Sapphire wafer deposited in stocker
Standard Accessories Include:
- USB flash drive
- 20L bottle
- Measuring cup
- Cover lock release key
- Jig for transfer adjustment
- General tool kit
- Lifting Jig Set
- Packing
- Installation (Up to, but not limited to, 15 days)
- Operation training (5 days)
- Sapphire separation and removal by vacuum
2020 Vintage

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