ASM Nano Die Bonder, 8"
- Substrate & Die Loading: manual on tray
- System Placement Accuracy: ± 0.3µm @ 3s
- Cycle Time: ~25 sec per die
- Bond Process: Eutectic Bonding AuSn
- Uptime: >95%
- Bond Force: up to 2kg
NANO Basic System
- Granite based platform, welded framework in Paint Color RAL 7035
- Pneumatic and Vacuum system, machine housing in Paint Color RAL 9003
- Motion controlling system
- Vibration damping system
- Basic System Documentation,
- Standard Industrial PC
- Windows 10 operating system
- Keyboard, graphic display
- Graphical user interface
- Ethernet TCP/IP
- Cmk test Unit
- Uninterruptable Power Source (UPS for PC only)
- Utilities: 0.6MPa compressed dry air (D=8mm), 0.02MPa vacuum (D=8mm), 2 x exhaust air (D=125mm), 400V, 16A, 3 Phase)
Vision System
- COGNEX Vision Pro system
- Provides access to COGNEX’s entire vision library
- Programmable standard vision tools
- Customized tools for the application
X-Y Component Presentation - Wafer Stage
- 300x300mm XY-stage for Wafer, Waffle Pack or GelPak
- Supports up to 300mm Wafers
- Ionizer unit
- Manual load and unload system
Lens and Vision system - Wafer Stage
- CCD camera with lens
- RGB coaxial lighting system
- Z-axis with servo motor and encoder for close loop operation
- Software autofocus
- Wafer Optics Z-Axis
Transfer system for the Bond head
- Transfer-Axis – AFC Plus
- X- and Z-stage with servo motor and absolute encoder for close loop operation with Resolution of 0.1µm
High precision Pick-Up/Bondhead
- Aperture 40mm
- Rotation axis , resolution 0.001°
- 12mm stroke , +/- 6mm – travel in Y direction, resolution 0.1µm
- Active bond force measurement unit with both fixed force or dynamic force control
- Bond force up to 2kg both force bond and position bond capability
- Bondhead Calibration Unit with integrated glass alignment features
- Absolute Linear Encoder
Process Gas Unit – Bondhead Manifold on Bond head
- Supports nitrogen or forming gas
Mapping/Alignment Camera System with Upward and Downward Looking Cameras
- Two lens systems for upward looking and downward looking vision capability
- Two CCD cameras with lens system
- Coaxial RGB lighting downward looking optics
- Coaxial RGB lighting upward looking optics
- Z- stage with servo motor and encoder for close loop operation
- Autofocus function
X-Y Bond Stage for substrate presentation system
- High precision XY-open frame stage for <±1.0µm placement accuracy
- Linear drive closed loop system with 0.1µm resolution
- Accommodates up to 12” wafer with laser heating option
- Ionizer unit
Lens and Vision system - Bond Stage
- CCD camera with lens
- RGB coaxial lighting system
- Z-axis with servo motor and encoder for close loop operation
- Software autofocus
- Bond Optics Z-Axis
2021 Vintage