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Besi / Datacon 2200 EVO Die Bonder
Besi / Datacon 2200 EVO Die Bonder
Besi / Datacon 2200 EVO Die Bonder
Besi / Datacon 2200 EVO Die Bonder
Besi / Datacon 2200 EVO Die Bonder
Besi / Datacon 2200 EVO Die Bonder
Besi / Datacon 2200 EVO Die Bonder

Besi / Datacon 2200 EVO Die Bonder

Asset #: 74673

Make: Besi / Datacon

Model: 2200 EVO

Last Confirm Date: October 23, 2023

Besi / Datacon 2200 EVO Die Bonder
Configuration:
- Dynamic XYZ Theta servo motors
- Pattern recognition system with edge, pattern and ink-dot recognition
- Programmable lighting system with RGB light (partial)
- Machine capability 10 um at 3 sec
- CMOS substrate camera / optics / illumination
- Upward looking camera
- Wafer camera
- Transport system
- Bondforce sensor and Mini-BMC kit
- Theta axis rotary bond head, theta range 0 – 360 deg, with 0.0045 deg resolution
- Teach-in programming, menu driven by integrated ETX-based industry PC and Linux GUI
Options:
- Change module to Classic belt transport system
- Input buffer 2200 Evo
- Output buffer 2200 Evo
- 2200 Evo Integrated dispenser
Ionizer unit
- Connection kit for 2200 Evo
- SECS/GEM
- SEMI E142 (SECS/GEM required)
Accessories:
- Standard tooling 2200 Evo
Customized Features:
- Large FOV substrate camera
- Jetter unit (include heater and nozzle)
- High precision weight scale
- Jetter nozzle cleaning station
- Retrofit kit for TS in combination with XL carrier
- Ultra Clean kit Gen3
- XL carrier for 9” x 9” tray
2011 Vintage

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