Perkin Elmer 4410 Sputtering System
Customer programming of recipe for process parameters.
Process parameters recorded on system computer.
Optional GEM/SECS II functions.
24V DC control components

DC gear motors with encoder to run table rotate/ table
up & down

DC gear motors run shutters/pallet carriage moving
Vacuum gauge/vacuum control system
Gas control system
RF automatically matching network
DC power / RF generator can be mounted in the frame
Plumbing system
Cables/wires harness
High rate delta DC magnetron sputtering: Aluminum and
aluminum alloys can be sputter deposited at rates in excess
of 1800 A /min, with loads of thirty 3" or thirteen 4"wafers.

High throughput operation: Automated load lock and
controller sequences provide for efficient pump-down and
pallet transfer to process chamber, maximizing throughput.
High uniformity: +/-7 guaranteed with water-cooledd
rotating annular substrate table; +/-5 achievable.

The right sputter mode for each application: Sputter deposit,
DC Megnetion. Optina!: Sputter Etching, Pulse-DC, Bias
Sputter, RF Magnetron, RF Diode.

Ultra-clean vacuum: Cryopump and Meissner-trapped
process chamber ensures contamination-free conditions
especially important for critical processes.

Designed for operator safety: Two-button operation initiates
pump-down and load sequence. Safety interlocks on DC and
RF suppliers .

Easy maintenance: New Designed removable depositionzl
shields permit easy system cleaning. Automatic cryopump
regeneration minimizes downtime and inconvenience.
Easy wafer loading: Tweezer grooves facilitate wafer loading .
Nested pallets are optional.

A fail-safe system: Water flow switches on cathodes, chamber
and vacuum system automatically shut the system down in
case of cooling system failure .