AccuSputter AW 4450 Sputtering System, 3", 4"
- Customer programming of recipe for process parameters.
- Process parameters recorded on system computer.
- Optional GEM/SECS II functions.
-24V DC control components -DC gear motors with encoder to run table rotate/ table up & down
- DC gear motors run shutters/pallet carriage moving
- Vacuum gauge/vacuum control system
- Gas control system
- RF automatically matching network
- DC power / RF generator can be mounted in the frame
- Plumbing system
- Cables/wires harness
- High rate delta DC magnetron sputtering: Aluminum and
aluminum alloys can be sputter deposited at rates in excess
of 1800 A /min, with loads of thirty 3" or thirteen 4" wafers.
- High throughput operation: Automated load lock and controller sequences provide for efficient pump-down and
pallet transfer to process chamber, maximizing throughput.
- High uniformity: +/-7 guaranteed with water-cooled rotating annular substrate table; +/-5 achievable.
- The right sputter mode for each application: Sputter deposit,
DC Megnetion. Optional: Sputter Etching, Pulse-DC, Bias
Sputter, RF Magnetron, RF Diode.
- Ultra-clean vacuum: Cryopump and Meissner-trapped process chamber ensures contamination-free conditions
especially important for critical processes.
- Designed for operator safety: Two-button operation initiates
pump-down and load sequence.
-Safety interlocks on DC and
RF suppliers .
- Easy maintenance: New Designed removable depositional
shields permit easy system cleaning.
- Automatic cryopump
regeneration minimizes downtime and inconvenience.
-Easy wafer loading: Tweezer grooves facilitate wafer loading .
- Nested pallets are optional. A fail-safe system: Water flow switches on cathodes, chamber
and vacuum system automatically shut the system down in
case of cooling system failure .