Skip to content
Skip to product content
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder
ASM ADL 838 LG 2 Die Bonder

ASM ADL 838 LG 2 Die Bonder

Asset #: 72079

Make: ASM

Model: ADL 838 LG 2

ASM ADL 838 LG 2 Die Bonder
Wafer System:
- 0 hours ran
- Input type: clamp ring / wafer expander
- Wafer size: 6" on clamp ring / 8" on expander
Pattern Recognition System:
- PR system: full color, 256 grey levels
Facilities Required:
- Voltage: 100 - 240 VAC (single phase)
- Frequency: 50/60 Hz
- Full-load consumption: ~ 1,500 W
System Capability:
- UPH: 14,000+ (ASMPT in-house test)
Material Handling Capability:
- Die Size: 6 x 6 mil - 80 x 80 mil
- (0.15 x 0.15mm - 2.03 x 2.03mm)
- Without up-look inspection 6 x 6 mil - 400 x 400 mil
- (0.15 x 0.15 mm - 10.16 x 10.16 mm)
- Flip Chip Handling: standard
- Substrate Size:
- Length: 2.36" - 11.81"
- Width: 2.36" - 3.94"
- Thickness: 5 - 118 mil
- Magazine Size:
- Length: 2.36" - 12.20"
- Width: 2.36" - 4.33"
- Height: 2.68" - 7.48"
Bond Head:
- Bond force: Programmable (30 - 300g)
- High force bond head
- Spare parts kit from OEM
2020 Vintage

Recommended Products


Equipment Sourcing:

Unmatched Expertise in Global Procurement

See More of Our Equipment

At Bridge Tronic Global, we leverage our extensive network and industry expertise to source high-quality semiconductor manufacturing equipment from trusted suppliers worldwide. Whether you're looking for cutting-edge technology or reliable pre-owned equipment, our sourcing capabilities ensure that you receive the best options tailored to your needs.

We understand that every client's requirements are unique, so we prioritize transparency, thorough vetting, and a deep understanding of the global market to secure the right equipment for your operations. Our team is dedicated to delivering timely, cost-effective solutions without compromising on quality or performance.


Wafer test machine

Refurbishment: Restoring Excellence, Maximizing Value

At Bridge Tronic Global, our refurbishment services breathe new life into used semiconductor manufacturing equipment, ensuring peak performance at a fraction of the cost. Our expert technicians meticulously restore equipment from leading brands like KLA andΒ Hitachi, applying rigorous testing and quality control measures. Whether you need a single piece refurbished or a fleet of equipment overhauled, we deliver reliable, high-performing solutions that extend the lifespan of your assets while optimizing your budget.

Cart

Your cart is currently empty