{"product_id":"72079","title":"ASM ADL 838 LG 2 Die Bonder","description":"ASM ADL 838 LG 2 Die Bonder\u003cbr\u003eWafer System:\u003cbr\u003e- 0 hours ran \u003cbr\u003e- Input type: clamp ring \/ wafer expander\u003cbr\u003e- Wafer size: 6\" on clamp ring \/ 8\" on expander\u003cbr\u003ePattern Recognition System:\u003cbr\u003e- PR system: full color, 256 grey levels\u003cbr\u003eFacilities Required: \u003cbr\u003e- Voltage: 100 - 240 VAC (single phase)\u003cbr\u003e- Frequency: 50\/60 Hz\u003cbr\u003e- Full-load consumption: ~ 1,500 W\u003cbr\u003eSystem Capability:\u003cbr\u003e- UPH: 14,000+ (ASMPT in-house test)\u003cbr\u003eMaterial Handling Capability:\u003cbr\u003e- Die Size: 6 x 6 mil - 80 x 80 mil\u003cbr\u003e- (0.15 x 0.15mm - 2.03 x 2.03mm)\u003cbr\u003e- Without up-look inspection 6 x 6 mil - 400 x 400 mil\u003cbr\u003e- (0.15 x 0.15 mm - 10.16 x 10.16 mm)\u003cbr\u003e- Flip Chip Handling: standard\u003cbr\u003e- Substrate Size:\u003cbr\u003e   - Length: 2.36\" - 11.81\"\u003cbr\u003e   - Width: 2.36\" - 3.94\"\u003cbr\u003e   - Thickness: 5 - 118 mil\u003cbr\u003e- Magazine Size:\u003cbr\u003e   - Length: 2.36\" - 12.20\"\u003cbr\u003e   - Width: 2.36\" - 4.33\"\u003cbr\u003e   - Height: 2.68\" - 7.48\"\u003cbr\u003eBond Head: \u003cbr\u003e- Bond force: Programmable (30 - 300g)\u003cbr\u003e- High force bond head\u003cbr\u003e- Spare parts kit from OEM\u003cbr\u003e2020 Vintage","brand":"Bridge Tronic Global","offers":[{"title":"Default Title","offer_id":44816536731838,"sku":"72079","price":0.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0651\/6175\/6862\/files\/ASML_2_d6b6767a-e036-48f4-86c0-5047f6a23d57.jpg?v=1775745314","url":"https:\/\/www.bridgetronic.com\/products\/72079","provider":"Bridge Tronic Global","version":"1.0","type":"link"}