Multitest MT 2168 Pick and Place Handler
Available Versions:
- Ambient, ambient hot (+155° C)
- Up to 8 contact sites
Available Options (Selection)
- Active Temperature Control (ATC)
- Active Socket Purge (ASP)
- High Contact Force
- Soft Touch
- Double Device Detection
- Uses conversion kits for easy package style conversion
- Required Conversion Time: 10 to 20 minutes
- No adjustments required after package style conversion
- Conversion Kits for: - QFP, BGA, QFN, SO, TO, LGA
- Min. and Max. Size of Packages: 2x2 to 70x70 mm min. pitch: 0.4 mm (standard set-up)
- All commonly used trays acc. to JEDEC standard CO-012, CO-029 and CO-034
- Type of Loader: tray stack, separate input/output tray loop
- Plunger Force: up to 5,000 N
- Soak Capacity: equal to 3 – 4 JEDEC trays
Dynamic Contact Site Accuracy:
- +/- 2º C
- +/- 1º C with ATC
- Temperature Control Stability (static measurement): +/- 0.2º C
- 6 tray categories (stack or manual)
- Software binning categories: 32
- Docking Height: 990 mm (Floor to CUH Centre)
- All commonly used docking systems and test heads are supported.
- Throughput: example x16 mode: 15,000 uph at 3 s test time
- Index Time: (virtual index time for multiple contact sites)
- Single mode: 0.700 s
- Dual mode: 0.350 s / device
- Quad mode: 0.175 s / device
- Octal mode: 0.088 s / device
2014 Vintage