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Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder
Besi / Datacon 8800 Chameo Bonder

Besi / Datacon 8800 Chameo Bonder

Asset #: 61045

Make: Besi / Datacon

Model: 8800 Chameo

Wafer Sizes: 8, 12 inch

Besi / Datacon 8800 Chameo Bonder, 8", 12"
- Non functional
- Vision system:
a) Substrate camera: FOV 7.7 x 5.8mm (10.3um/pixel)
b) Uplook camera: FOV 2.0 x 1.5mm (2.6um/pixel)
- Carrier size: 12" (310mm)
- Base wafer size: 8" and 12" wafer taped in same ring frame (376mm x 380mm)
- Multi chip (yes)
- UPH (no dipping): Up to 6000 UPH (depends on die size and number of die per package)
- Face Down
- Known defective parts: 1. Flipper assembly for the left and right gantry 2. CAN driver for the lifter 3. Drivers board for the gantry Z axis, X axis and Y axis 4. Force control board for bond head
2009 Vintage

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