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Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder
Besi / Datacon 8800 Chameo Flip Chip Bonder

Besi / Datacon 8800 Chameo Flip Chip Bonder

Asset #: 58197

Make: Besi / Datacon

Model: 8800 Chameo

Besi / Datacon 8800 Chameo Flip Chip Bonder
- No temperature option
- Flux dipping process
- Double gantry system
- Standard wafer table (w/out stretcher and rotation)
- Wafer transfer system
- Wafer centering station
- Wafer lift
- (2) flip units
- (2) Up-looking cameras and (2) substrate cameras
- Wafer camera with twin-field optics
- (2) Bond heads with theta rotary axis
- Wafer barcode scanner
- Automatic eject tool changer
2009 Vintage

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