{"product_id":"57233","title":"Besi \/ Datacon 8800 TC Die Bonder","description":"Besi \/ Datacon 8800 TC Die Bonder, 8\" to 12\"\u003cbr\u003e- X\/Y placement accuracy: ± 2 μm @ 3 sigma\u003cbr\u003e- Accuracy self check: Single BMC kit\u003cbr\u003e- Output: up to 1,000 UPH\u003cbr\u003e- Number of bond heads: 2\u003cbr\u003e- 7-axis TC bond head: -4° - 4° rotation\u003cbr\u003e- Tool heating: up to 420 °C\u003cbr\u003e- Ramping speed: + 200 °C\/s (Heating) - 100 °C\/s (Cooling)\u003cbr\u003e- Temperature uniformity: ± 5 °C\u003cbr\u003e- Interface temperature monitoring: Integrated measurement\u003cbr\u003e- Bond force: 3 - 250 N (full UPH)\u003cbr\u003eBond control: Force \/ Height \/ Both combined\u003cbr\u003eTool flatness: ± 1 μm\u003cbr\u003eCo-planarity: ± 2 μm @ 10 mm\u003cbr\u003eCo-planarity set-up: Automatic\u003cbr\u003eComponents\u003cbr\u003e- Die size: 2 - 16 mm\u003cbr\u003e- Die thickness: 50μm - 3mm, thinner on request\u003cbr\u003e- Multi-chip Capability\u003cbr\u003e- Multi-chip modes: Stacked die or Side-by-side\u003cbr\u003e- Wafer change: Automatic (up to 25 types per cassette)\u003cbr\u003e- Pick \u0026amp; Place tool change: Manual\u003cbr\u003e- Ejector tool change: Automatic (up to 3 sizes)\u003cbr\u003e- Bond profiles: Individual bond profiles per stack layer\u003cbr\u003eComponent Handling\u003cbr\u003e- Flip chip unit: Pick-up of the component from wafer, 180° rotation of the flip arm and presentation to the bond head\u003cbr\u003e- Wafer pre-rotation: 0° - 280°\u003cbr\u003e- Cassettes: 1\u003cbr\u003e- Cassette size: up to 25 film frames per cassette\u003cbr\u003eSubstrate Handling\u003cbr\u003e- Substrate \u0026amp; carrier transport: Gripper based with vacuum cups\u003cbr\u003e- Wafer transport: Robot handling (from dual FOUP port on request)\u003cbr\u003e- I\/O buffer: Flat belt system, inline (SMEMA) or stand-alone possible\u003cbr\u003e- I\/O Elevator type: Programmable lift systems for one magazine\u003cbr\u003eTool system\u003cbr\u003e- Bond tools: Integrated heater \/ cooler and temperature sensor\u003cbr\u003e- Single chip ejector: For one configured ejector tool\u003cbr\u003e-Multi chip ejector: Automatic quick changing carousel system, max. 3 ejector tools\u003cbr\u003eField of View\u003cbr\u003e- Wafer camera: 12 x 12 mm \u003cbr\u003e- Substrate camera: 2.0 x 1.6 mm\u003cbr\u003e- Up-looking camera: 2.0 x 1.6 mm\u003cbr\u003e- Illumination: Programmable RGB lighting (4 different colors)\u003cbr\u003e- Image recognition methods: Circle search, edge search, bump search, feature matching, structure search, epoxy inspection, contour inspection, datamatrix recognition, ...\u003cbr\u003eComputer and MMI system\u003cbr\u003e- Operating system: Linux\u003cbr\u003e- User interface (GUI): User-friendly graphical user interface with pull-down menus\u003cbr\u003e- Monitor: 2x 19\" flat screen\u003cbr\u003e- Data storage: HDD, USB\u003cbr\u003e- Data transfer: FTP via TCP\/IP network, SECS\/GEM\u003cbr\u003e- Interface: SMEMA 1.2, SECS-II (GEM Compliant)","brand":"Bridge Tronic Global","offers":[{"title":"Default Title","offer_id":44814996209854,"sku":"57233","price":0.0,"currency_code":"USD","in_stock":true}],"url":"https:\/\/www.bridgetronic.com\/products\/57233","provider":"Bridge Tronic Global","version":"1.0","type":"link"}