Besi / Datacon 8800 TC Die Bonder, 8" to 12"
- X/Y placement accuracy: ± 2 μm @ 3 sigma
- Accuracy self check: Single BMC kit
- Output: up to 1,000 UPH
- Number of bond heads: 2
- 7-axis TC bond head: -4° - 4° rotation
- Tool heating: up to 420 °C
- Ramping speed: + 200 °C/s (Heating) - 100 °C/s (Cooling)
- Temperature uniformity: ± 5 °C
- Interface temperature monitoring: Integrated measurement
- Bond force: 3 - 250 N (full UPH)
Bond control: Force / Height / Both combined
Tool flatness: ± 1 μm
Co-planarity: ± 2 μm @ 10 mm
Co-planarity set-up: Automatic
Components
- Die size: 2 - 16 mm
- Die thickness: 50μm - 3mm, thinner on request
- Multi-chip Capability
- Multi-chip modes: Stacked die or Side-by-side
- Wafer change: Automatic (up to 25 types per cassette)
- Pick & Place tool change: Manual
- Ejector tool change: Automatic (up to 3 sizes)
- Bond profiles: Individual bond profiles per stack layer
Component Handling
- Flip chip unit: Pick-up of the component from wafer, 180° rotation of the flip arm and presentation to the bond head
- Wafer pre-rotation: 0° - 280°
- Cassettes: 1
- Cassette size: up to 25 film frames per cassette
Substrate Handling
- Substrate & carrier transport: Gripper based with vacuum cups
- Wafer transport: Robot handling (from dual FOUP port on request)
- I/O buffer: Flat belt system, inline (SMEMA) or stand-alone possible
- I/O Elevator type: Programmable lift systems for one magazine
Tool system
- Bond tools: Integrated heater / cooler and temperature sensor
- Single chip ejector: For one configured ejector tool
-Multi chip ejector: Automatic quick changing carousel system, max. 3 ejector tools
Field of View
- Wafer camera: 12 x 12 mm
- Substrate camera: 2.0 x 1.6 mm
- Up-looking camera: 2.0 x 1.6 mm
- Illumination: Programmable RGB lighting (4 different colors)
- Image recognition methods: Circle search, edge search, bump search, feature matching, structure search, epoxy inspection, contour inspection, datamatrix recognition, ...
Computer and MMI system
- Operating system: Linux
- User interface (GUI): User-friendly graphical user interface with pull-down menus
- Monitor: 2x 19" flat screen
- Data storage: HDD, USB
- Data transfer: FTP via TCP/IP network, SECS/GEM
- Interface: SMEMA 1.2, SECS-II (GEM Compliant)