KLA 6220 Inspection System, 2", 3", 4", 6", 8"
- Thickness: SEMI Standard Wafer Thickness
- Material: Any Opaque, Polished Surface which Scatters less than 5 percent of Incident Light
- Defect Sensitivity: 0.09 Micrometer Diameter PSL Sphere Equivalent with greater than 80 percent Capture Rate (0.112um@ 90%)
- Repeatability: Count Repeatability Error less than 0.5 percent at 1 Standard Deviation (Mean Count greater than 500,0.364 mm dia. Latex Spheres)
- Accuracy: Count Accuracy better than 99 percent (verified with VLSI Standards Relative Standard)
- Throughput: 100 wph (200 mm) at 0.12 mm
- Contamination: Less than 0.005 Particles/cm2 greater than 0.15 mm dia. per single pass
- Cassette Handling: Single Puck Wafer Handling from two Cassettes (one Sender/Receiver, one Receiver)
- Illumination Source: 30 mW Argon-Ion laser, 488 nm Wavelength
- Operator Interface: Mouse and/or Dedicated User Keypad
- Operations Manual and Documentation
1997 Vintage