Orthodyne 3700 Plus Wire Bonder
- Bond Area: 150 mm (Y) x 250 mm (X), 0.1 µm table resolution
- Z Axis: 50 mm Z - stroke, 0.5 µm resolution
- Theta Axis: ±220º, 0.00352º resolution
- Programmable Focus: Z-axis range, 0.5 µm resolution
- Microscope: Stereo zoom with adjustable work distance
- Monitor: 17-inch color flat panel
- Work Height: 1000 mm from the floor (nominal), adjustable (934 - 1050 mm), meets SMEMA requirements (940 - 965 mm)
Bondhead:
- Type: Orthodyne rotary; low mass; deep access
T- ear and Feed: Programmable clamp tear, optional table tear
- Bond Force: 10 - 200 g, ±1 for force settings < 50 g; ±2% for force settings > 50 g; 1 g programmable resolution
- Transducer: Orthodyne miniature; 120 kHz
- Bondtool: 0.062 in x 30.5 mm long
- Positioning Referencing/ Touchdown: Linear encoder with 0.1-µm resolution
- Wire Feed Angle: 45º or 60º angle
Wire Handling:
- Wire Range: 25 - 75 µm (1 - 3 mils) in diameter
- Wire Feed: Motorized dereeler with an optical encoder
- Missing Wire Detection: Wire deformation monitoring
- Wire Spool Size: 60 mm OD, 26 - 55 mm Width, 49 mm ID
Pattern Recognition:
- Vision System: Enhanced Orthodyne GSIII pattern recognition
- Optics: Option 1: (1.5x): 2.4 mm (H) x 1.8 mm (V) field of view; option 2: (2.3x): 1.6 mm (H) x 1.2 mm (V) field of view
- Lighting: Homogenous area lighting, programmable bondhead illumination with co-axial and direct lighting
- Die rotation: ± 7º from nominal for single- and dual-point modes; ± 20º from nominal for edge mode
Control and Interface
- CPU: VME PowerPC for Real-Time System (RTS); CPCI Pentium III for DataManager:
- File Storage: Hard disk, CD-RW
- Communication Ports: Ethernet, USB, printer; optional SECS-GEM interface, serial port
- Discrete I/O Lines: Standard: 32 lines, expanded: up to 64 lines (optional); two 32- line ports available on the front panel
- Operating System: VxWorks for Real Time Function, Windows XP for graphical user interface (GUI)