Pfeiffer / Alcatel AMS 4200 ICP (Inductively Coupled Plasma), 6"
Process Chamber 1:
- Silicon Oxide (RGV Dielectric) Etch Process Module
- High pressure RIE source reactor
- Substrate Holder with mechanical clamping chuck for 150mm
- BIAS 600W LF
- Reactor Pump: Adixen RVP 2033C2 on DN40 throttle valve
- Gas Lines: CF4, O2, CHF3, He
Process Chamber 2:
- Silicon Etch Process Module
- High Density, low pressure ICP plasma source
- Cryo temperature process
- Cryogenic Substrate Holder with mechanical clamping chuck for 150mm
- Source: 3kW RF & Auto Matching Network
- Laser View Port Adapter
- Pumping line to pump down the substrate holder
- He backside cooling
- BIAS 300W RF
- LN2 controlled cooling
- Deware LN2 Tank
- Reactor pump: PM ADP 122
- Maglev Turbo Pump: ATH 1600M
- DN200 heated throttle
- cold trap
- Gas Lines: SF6, O2, O2
Handling platform:
- BROOKS MX 600 platform with MAG 7 robot
- 6 sided platform: 2x Process modules, 2x Cassette Modules, 2x free
- 2 Cassette Modules BROOKS VCE6
Electrical Cabinet
RF Generators
PLC
Breakers
GUI
Control Module
End Point Dedection
Chiller
Gas Abatement
Electrical Transformer
2007 Vintage