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SCREEN / DNS SK 2000 Parts
SCREEN / DNS SK 2000 Parts
SCREEN / DNS SK 2000 Parts
SCREEN / DNS SK 2000 Parts
SCREEN / DNS SK 2000 Parts
SCREEN / DNS SK 2000 Parts
SCREEN / DNS SK 2000 Parts

SCREEN / DNS SK 2000 Parts

Asset #: 40603

Make: SCREEN / DNS

Model: SK 2000

Wafer Sizes: 8 inch

Last Confirm Date: March 22, 2019

SCREEN / DNS SK 2000 Parts, 8"
- Wafer Shape SNNF (Semi Notch No Flat) Wafer Cassette 8” PP Miraial
- Process Block (2)
- Coater head (2)
- Barc Coater head (2)
- Develop head (4)
- Adhesion Chamber (2)
- Cooling Plate (10)
- Rapid Hot Plate(RHP) (12)
- Hot Plate(RHP (3)
- EEW
- EEFT
- IFB
- Sources Bottle Cabinet(RESIST) 1 Chemical Box (HMDS/Solvent/NMDW) - Controller Cabinet 1
- Power Box
- Handling Unit Controller
- Carrier Station
- Stage 1×4 Side Loading (Sender /Receiver) Coater
- Nozzle (6)
- Resist temperature System 1 temp control for 3 line x 2
- Coater Cup PP+PP+PPS
- Spin chuck PEEK
- Resist Pump PDS-105C-KPM4-S01
- Back rinse flow meter with sensor
- VPS Pulse Mist Nozzle flow meter with sensor Edge Cleaner flow meter / sensor
- Solvent solution supply Central supply
- Drain Central
- Barc
- Nozzle (2)
- Resist temperature System 1 temp control for 1 line x 2
- Coater Cup PP+PP+PPS
- Spin chuck PEEK
- Resist Pump PDS-105C-KPM4-S01
- Back rinse flow meter with sensor
- VPS Pulse Mist Nozzle flow meter with sensor Edge Cleaner flow meter / sensor
- Solvent solution supply Central supply
- Drain Central
- Developer
- Nozzle Slit Scan Nozzle
- Develop solution supply Central supply Developer Cup PVC
- Spin chuck PEEK
- Develop Nozzle Flow meter with sensor Develop Nozzle Wash flow meter / sensor Rinse Nozzle Flow meter / sensor Back Rinse Flow meter / sensor Develop temperature System 1 temp control for 1 line x 2
- Method Vapor prime by N2 Bubbling
- Hot plate 60-150 deg by 0.1 deg pitch
- HMDS solution supply Central supply
- Hot Plate
- Method Proximity bake with ceramic ball Hot plate 50-180 deg by 0.1 deg pitch Cooling Plate
- Method Proximity bake with ceramic ball Cooling plate 20-25 deg by 0.1 deg pitch
- Rapid Hot Plate (RHP)
- Method Proximity bake with ceramic ball
- Hot plate 70-150 deg by 0.1 deg pitch
- Method Proximity bake with ceramic ball
- Hot plate 60-250 deg by 0.1 deg pitch
- EEW
- Lamp Mercury xenon
- Wave length 248nm
- EEFT (EEW and Thickness)
- Lamp Mercury xenon
- Wave length 248nm
- Lamp for resist thickness Harogen
- Wave length 400nm-800nm with low cut filter 480nm IFB
- Robot(BHU1) 1
- Robot(BHU2) 1
- Buffer 2

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