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EVG Gemini Production Wafer Bonder

Asset #: 24629

Make: EVG

Model: Gemini

Wafer Sizes: 6 inch

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EVG Gemini Production Wafer Bonder, 6"
- Fully-Automated Wafer Bonding System
- Up to 200mm Capability "but only tooled for 150mm"
- Currently Configured for 6"/150mm Wafers
- For High Volume Production Applications
- 4 Universal Wafer Bond Chamber w/ Top & Bottom Side Heaters
- 2 Gas Lines with no Flow Controllers
- Automatic Alignment
- Robotic Handling Between Cassette and Alignment Stage (No robot or controller installed)
- Robotic Handling Between Aligner and Bonder (No robot or controller installed)
- Send, Receive and Reject Cassette Stations
- Fully Motorized SmartView Splitfield Microscope for Double Side Viewing
- 40 kN pressure bonding capability
- Integrated Cooling Station for High Throughput
- Max Temperature: 550°C
-- Neslab System II Chiller
- System Computer with Windows MS OS
- RAID Hard Drive System
- Wafer ID Reader

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