{"product_id":"23356","title":"Speedfam 6 D S SP CMP (Chemical Mechanical Polisher)","description":"Speedfam 6 D S SP CMP (Chemical Mechanical Polisher), 4\" to 8\"\u003cbr\u003e- Dual polishing spindles for 100-200mm wafers\u003cbr\u003e- Dual spindle design provides for both single and double wafer processing, providing a significant throughput advantage \u003cbr\u003e- High throughput option increases production up to 30% \u003cbr\u003e- Hydrolift Load Station improves loading reliability\u003cbr\u003e- Two table design enables multi- step process capability\u003cbr\u003e- Proven process performance for oxides, tungsten and STI applications\u003cbr\u003e- Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control\u003cbr\u003e- Optional Axus Technology Titan Carrier - Upgrade delivers state-of-the-art process results, adding membrane carrier technology that improves uniformity, edge exclusion and removal rate","brand":"Bridge Tronic Global","offers":[{"title":"Default Title","offer_id":44812609945790,"sku":"23356","price":0.0,"currency_code":"USD","in_stock":true}],"url":"https:\/\/www.bridgetronic.com\/products\/23356","provider":"Bridge Tronic Global","version":"1.0","type":"link"}