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Speedfam 6 D S SP CMP (Chemical Mechanical Polisher)

Asset #: 23356

Make: Speedfam

Model: 6 D S SP

Wafer Sizes: 4, 5, 6, 8 inch

Last Confirm Date: May 25, 2017

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Speedfam 6 D S SP CMP (Chemical Mechanical Polisher), 4" to 8"
- Dual polishing spindles for 100-200mm wafers
- Dual spindle design provides for both single and double wafer processing, providing a significant throughput advantage
- High throughput option increases production up to 30%
- Hydrolift Load Station improves loading reliability
- Two table design enables multi- step process capability
- Proven process performance for oxides, tungsten and STI applications
- Pad conditioning system provides in-situ programmable selective pad conditioning with 20 zones of programmable control
- Optional Axus Technology Titan Carrier - Upgrade delivers state-of-the-art process results, adding membrane carrier technology that improves uniformity, edge exclusion and removal rate

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