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Applied Materials P 5000 Mark II PECVD (Plasma-Enhanced Chemical Vapor Deposition)

Asset #: 16883

Make: Applied Materials

Model: P 5000 Mark II

Wafer Sizes: 4, 5, 6, 8 inch

Last Confirm Date: March 10, 2017

Applied Materials P 5000 Mark II PECVD (Plasma-Enhanced Chemical Vapor Deposition), 4" to 8"
- Includes Modular Remote Frame
- Two MxP Etch Chambers, One PECVD Nitride Chamber. Phase III handling system. 28-line onboard gas panel.
- Integrated endpoint system with 2 monochromators.
- Currently configured for 100mm wafers
- System is fully configurable to your specifications
- Chamber 1: MxP Etch chamber configured for 100mm clamped Oxide process.
*Leybold Mag lev Turbo pump
*Phase IV RF match
*Heated gate valve/throttle valve
*ENI OEM 12 RF Generator
Can be configured from 100-200mm.<
- Chamber 2: MxP Etch chamber configured for 100mm clamped Poly process.
*Leybold Mag lev Turbo pump
*Phase IV RF match
*Heated gate valve/throttle valve
*ENI OEM 12 RF Generator.
Can be configured from 100-200mm.
- Chamber 3: no description offered
- Chamber 4: Standard Lamp Heated (100-150mm capable) Configured for 100mm Nitride Process.
*Includes DPA and DPA generator
*Phase IV RF match
*ENI OEM 12 RF Generator Can be configured from 100-150mm.

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