Disco DTG 8440 Taiko Grinder
- Fully Automatic
- Low Vibration Air Bearing Spindles (2)
- Probe Height Gauges for Measuring (2)
- Automatic Wheel Setup Function
- Edge clamping on Transfer Arms 2 & 3 instead of vacuum pads
- Fixed position stop function for chuck table & spinner table
- In-process wafer thickness measurement on Z1 & Z2
- Non-contact thickness gauge for normal & high doped wafers
- Non-recirculating Cutting and Cleaning Wafer System
- Reserve air switching unit for spindle air bearing protection
- Robotic Wafer Transportation
- Signal Tower
- Spindle Cooling Wafer System
- Spindle Rotation Speed Monitor
- T2-arm with vacuum pad, no edge clamping
- Taiko Grinding of 8" Wafer with V-notch
- Turntable with 3 Chuck Tabled for 8" Wafers with V-notch
- Vacuum maintenance using vacuum ejector
- Vacuum Pump System
- Wafer Cleaner with Spindle Table
- Z-axis Indices
- Wafer backside washing function
- Vacuum maintenance using vacuum ejector
- SECS/HSMS
- Wafer Temperature Control unit Model DTU 1550