{"product_id":"153537","title":"ASM M Feeder II Die Sorter \/ Bonder","description":"ASM M Feeder II Die Sorter \/ Bonder\u003cbr\u003e- Configured for Manual Panel Loading\u003cbr\u003e- Configured for Direct Die Placement onto Display Panel\u003cbr\u003eSystem Performance:\u003cbr\u003e- XY placement: ± 0.4 mil (10 um) @ 3g*\r- Die rotation: ±1°@ 3g*\r- Global array angle: ±0.01o*\r- Bonding cycle: 72 ms*\rMaterial Handling:\r- Die size: 90 x 90 - 500 x 500 um \r- Die thickness: 3.5 x 3.5-19.7 x 19.7 mil \/ Min 50 um\r- Input material: Standard JEDEC tray\r- No. of tray handling: 2\r- Carrier size: Max 60 x 60 x 1.5mm\r(With 50 x 50mm effective bonding area)\rBondhead System:\u003cbr\u003e- Bondhead Type: Single bondhead with 4 arms\u003cbr\u003eWafer System:\r- Wafer type: Foton ring\r- Wafer ring size (OD): 7.33\"\r- Expanded wafer size: 5.9\"\rPR System\r- Image mode: Color\r- Grey level: 256 grey level\rFacilities Requirement\u003cbr\u003e- Voltage: 220 Vac, Single Phase\r- Optional: 110 Vac\r- Frequency: 50\/60 Hz\r- Compressed air: 6 bar\r- Air consumption: 700 LPM @ 6bar\r- Vacuum pump: Option\r- Full load current: 24A @ 220V\u003cbr\u003e2019 (1), 2020 (3) Vintage","brand":"Bridge Tronic Global","offers":[{"title":"Default Title","offer_id":46650015875262,"sku":"153537","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0651\/6175\/6862\/files\/1_f3167efd-b92f-4deb-b469-0fe9b946e927.jpg?v=1776443014","url":"https:\/\/www.bridgetronic.com\/products\/153537","provider":"Bridge Tronic Global","version":"1.0","type":"link"}