SUSS MA 8 / BA 8 Mask Aligner
- Backside Optical Alignment
- Wafer Loading: Manual loading & unloading
- Air floating optical table
Microscope System:
- Equipped with 2 sets of left & right microscopes
- Microscopes include a 3-axis automatic movement stage
- Manual focus adjustment function
- High definition & resolution industrial camera
- Microscope Lenses: 2× 5× lenses, 2× 10× lenses
Optical System:
- 1000 W UV mercury lamp
- UV 400 optical path system
- Light source position can be manually adjusted
Alignment System:
- Equipped with a dedicated mask holder; Manual mask loading / unloading
- High precision micrometer for wafer alignment adjustment
- Micrometer axes: X / Y / θ (theta)
- X / Y minimal travel: 10 mm
- θ-axis maximum rotation angle: ±5°
Exposure Modes:
- Proximity
- Soft contact
- Hard contact
Main Mechanical Parameters:
- Mercury lamp intensity: 12 mW/cm² - Proximity (20 μm): 2.5 μm resolution - Exposure Modes: Contact (soft, hard), proximity Exposure Optics - Resolution: down to 0.8 μm - Wavelength range: UV400 (350–450 nm) - Intensity uniformity: ±5%
Alignment Methods: - TSA accuracy: down to 0.5 μm Alignment Stage: - Movement range X: ±10 mm Y: ±5 mm θ: ±5° - Mechanical accuracy: 0.1 μm (step size) - Exposure area: ≥ 200 mm diameter
Utility Requirements - Vacuum: < -0.8 bar - Compressed air: 5–7 bar - Nitrogen: 2–3 bar - Power supply: 200–240 V, 3 kVA