Ulvac SDP 570 VMS In Line Sputtering
- Sputter Method: (DC Magnetron Sputtering)
- Takt Time (Cycle Time): 2.5 min
- Loader / Unloader: Manual substrate Loading)
- Elevator
- Preparation Chamber
- Isolation Room
- Removal Chamber
- Return Conveyor
- Required Electric Power: 3 phase, 220 V, 60 Hz, 615 kVA
- Substrate Material: Glass
- Required Floor Space: Approx. W 7000 × L 32,000 × H 3000 mm
Process Chamber:
- Sputtering Chamber
- Input Chamber -> Cathode Chamber -> Output Chamber
Vacuum Conditions:
- Preheat Chamber: ≤ 1 × 10⁻⁶ Torr - Sputtering Chamber: ≤ 1 × 10⁻⁶ Torr - Isolation Chamber: ≤ 1 × 10⁻⁶ Torr
Pump Down Time:
- Preheat Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr - Removal Chamber: Approx. 45 seconds from atmospheric pressure to 0.2 Torr
Sputtering Conditions:
- Target Attachment Method: Metal bonding to backing plate
- Sputtering Pressure: 8 × 10⁻⁴ to 8 × 10⁻³ Torr
- Thickness uniformity: 2.5 min
Film Thickness
- 1100 Å - (Cr film, when takt time is 2.5 minutes)
Target Size
- 144 mm × 690 mm × 6 mm - Substrate on both sides
Required Compressed Air:
- 5–7 kg/cm²G - Approx. 105.0 Nm³/hr (average)
Required N2 Gas:
- 0.5 kg/cm²G - Max: approx. 202 Nm³/hr - Normal: approx. 20.0 Nm³/hr
Required Process Gases:
- Ar: 0.5 kg/cm²G, sccm - X: 0.5 kg/cm²G, sccm - Y: 0.5 kg/cm²G, sccm - Z: 0.5 kg/cm²G, sccm
Required Water Cooling:
- 2.5 kg/cm²G - Approx. 25.2 m³/hr - Water temperature: 15–30 °C
1995 Vintage