K&S IBond 5000 Wire Bonder
- Ball-wedge bonding capability
- 100-240 V, 50/60 Hz
- Wire feed angle 90 degrees, vertical feed
- Spool Size: Ball bonding 2" x 1" double flange spool
Gold Wire Diameter:
Ball bonding and wedge bonding
- 0.7 mil to 3.0 mil diameter
- 17 micron to 75 micron diameter
Copper Wire
- 0.7 mil ro 2 mil
- 12 micron to 50 micron
Bonding Tool Specifications:
Ball bonding capillary lengths
- 0.375"
- 0.437"
- 0.625"
XY Table:
- Bonding Area: 135 x 135 mm (5.3 x 5,3 ")
- Throat Depth: 143 mm (5.6")
- Gross Table Motion: 14 mm (o.55")
- Fine Table Motion: 14 mm (0.55")
- Mouse Ratio:6:1
Motorized Y:
- Setback up to 4 mm (160 mil)
- Reverse up to 0.25 (10 mil)
- Kink height up to 0.5 mm (20 mil)
Z Axis Control:
- 0.500” (12.5 mm) ‘Z’ travel
- Increased travel range
- Full range of control with the ‘Z’ motor
Ultrasonic System:
- High Q 60kHz K&S transducer
- Phase Lock Loop self-tuning ultrasonic generator
Parameters:
- Low Ultrasonic Power: 1.3 watts
- High ultrasonic Power: 2.5 watts
Bond Time (Selectable Range):
- 10-100 milliseconds
- 10-1000 milliseconds
Bond force (Static Force Adjust):
- 10-250 grams (requires added weights >80 grams)
- No springs
- Bond Force Coil Range –
- Added 3-80 grams (depends on Force parameter setting)
- Separate 1st bond and 2nd bond parameters
- No springs
Wire Termination:
- Programmable tail pull for ball bonding
Temperature Control:
- Built-in
- Range up to 250 o C, +/- 5 oC