{"product_id":"138992","title":"Disco DFG 841 Grinder \/ Lapper \/ Polisher","description":"Disco DFG 841 Grinder \/ Lapper \/ Polisher, 8\"\u003cbr\u003e- Spindle Speed (Max): 7,000 rpm\u003cbr\u003e- Power: AC 200V, 50\/60 Hz, 3-Phase, 17 kVA\u003cbr\u003e- Air Requirement: 0.5 MPa (5 kgf\/cm²), 300 L\/min (ANR)\u003cbr\u003e- Cutting Water: 0.2 MPa (2 kgf\/cm²), 15 L\/min\u003cbr\u003e- Cooling Water: 0.2 MPa (2 kgf\/cm²), 11 L\/min\u003cbr\u003e- Grinding Method: In-feed grinding with wafer rotation\u003cbr\u003e- Accuracy: Planarity ≤ 1.5 µm across wafer\u003cbr\u003e- Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).\u003cbr\u003e- Chiller Unit– stabilizes grinding fluid temperature.\u003cbr\u003e- Filter Unit– for grinding water\/coolant circulation.\u003cbr\u003e- Robot Unit– automated wafer handling between cassettes and chuck tables.\u003cbr\u003e- Transformer (20 kVA, Tokyo Sanyo Denki) – converts facility power (208–415 V input → 200 V output).\u003cbr\u003e- Electrical Compartment– control and power distribution\u003cbr\u003e- Two chuck tables(porous vacuum type).\u003cbr\u003e- Automatic cassette loading\/unloading with same-cassette return.\u003cbr\u003e- Wafer thickness measurement(contact gauge system).\u003cbr\u003e- Spindle options: Configurable for coarse + fine grind\u003cbr\u003e- with HDD and Software\u003cbr\u003e1998 Vintage","brand":"Bridge Tronic Global","offers":[{"title":"Default Title","offer_id":45337518571710,"sku":"138992","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0651\/6175\/6862\/files\/2_363fd226-45cc-45f6-946a-aa3c0680ddb2.jpg?v=1756138108","url":"https:\/\/www.bridgetronic.com\/products\/138992","provider":"Bridge Tronic Global","version":"1.0","type":"link"}