Disco DFG 841 Grinder / Lapper / Polisher, 8"
- Spindle Speed (Max): 7,000 rpm
- Power: AC 200V, 50/60 Hz, 3-Phase, 17 kVA
- Air Requirement: 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)
- Cutting Water: 0.2 MPa (2 kgf/cm²), 15 L/min
- Cooling Water: 0.2 MPa (2 kgf/cm²), 11 L/min
- Grinding Method: In-feed grinding with wafer rotation
- Accuracy: Planarity ≤ 1.5 µm across wafer
- Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).
- Chiller Unit– stabilizes grinding fluid temperature.
- Filter Unit– for grinding water/coolant circulation.
- Robot Unit– automated wafer handling between cassettes and chuck tables.
- Transformer (20 kVA, Tokyo Sanyo Denki) – converts facility power (208–415 V input → 200 V output).
- Electrical Compartment– control and power distribution
- Two chuck tables(porous vacuum type).
- Automatic cassette loading/unloading with same-cassette return.
- Wafer thickness measurement(contact gauge system).
- Spindle options: Configurable for coarse + fine grind
- with HDD and Software
1998 Vintage