{"product_id":"130174","title":"EVG 520 Manual Wafer Load Substrate Bonder","description":"EVG 520 Manual Wafer Load Substrate Bonder, 2\" to 6\"\u003cbr\u003e- Capable of fusion compression bonding\u003cbr\u003e- Capable of thermal compression bonding\u003cbr\u003e- Capable of anodic bonding\u003cbr\u003e- Ideal for R\u0026amp;D and pilot production applications\u003cbr\u003e- High-vacuum capable bond chamber\u003cbr\u003e- Auto opening of bond tool cover\u003cbr\u003e- Windows based control software and operation interface\u003cbr\u003e- Wafer size: up to 6\"\/150mm capable\u003cbr\u003e- Max Bond Force: 40 kN\u003cbr\u003e- Top side heater: 550°C max. in 1°C steps\u003cbr\u003e- Bottom side heater: 550°C max. in 1°C steps\u003cbr\u003e- Temperature uniformity: ± 1,5 %\u003cbr\u003e- Turbo pump and controller\u003cbr\u003e- Roughing pump\u003cbr\u003e- Load\/unload tool\u003cbr\u003e- System computer, monitor, and keyboard\u003cbr\u003e2005 Vintage","brand":"Bridge Tronic Global","offers":[{"title":"Default Title","offer_id":44929484849342,"sku":"130174","price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0651\/6175\/6862\/files\/LES-9053a.jpg?v=1741978844","url":"https:\/\/www.bridgetronic.com\/products\/130174","provider":"Bridge Tronic Global","version":"1.0","type":"link"}