{"product_id":"129130","title":"EVG 850 LT Bonder","description":"EVG 850 LT Bonder, 8\"\u003cbr\u003e- Basic Unit\u003cbr\u003e- Handling Unit\u003cbr\u003e- High Performance SOI Quality Capabilities\u003cbr\u003e- Facility connections Through Machine Bottom Side\u003cbr\u003e- Modular Machine Platform\u003cbr\u003e- Buffer \/ Cooling Station for 100 - 200 mm Wafers\u003cbr\u003e- User Interface\u003cbr\u003e- Software: EVG CIMFramework (without license)\u003cbr\u003e- Fully Automated Ergo Load Cassette Station, Non-tiliting (4)\u003cbr\u003e- Material Mapping Unit (MMU) (4)\u003cbr\u003e- Additional Standard Pre-Aligner\u003cbr\u003e- SECS \/ GEM - Hardware \/ Software Interface (F008)\u003cbr\u003e- EDA - Equipment Data Acquisition (Interface A) (F0009) \u003cbr\u003e- Wafer ID Reader\u003cbr\u003e- Filter Fan Unit ISO 3 for Process and Handling Area\u003cbr\u003e-  Filter Fan Unit ISO 3 for Process and Handling Area for 5th Module\u003cbr\u003e- Activated Carbon Filters\u003cbr\u003e- Ionizer Bar for Handling Area T-Frame\u003cbr\u003e- Charge Plate Monitor\u003cbr\u003e- Charge Plate \u003cbr\u003e- IR-Inspection Station for up to 200 mm wafers\u003cbr\u003e- IR Set for 200 mm Wafers with Notch\u003cbr\u003e- Rejected Wafer Sorting Software\u003cbr\u003e- Prebond Module -Closed Type\u003cbr\u003e- Prebond Chuck for 200 mm Wafers\u003cbr\u003e- Vacuum system for Bond Module\u003cbr\u003e- Turbo molecular pump for Bond Module\u003cbr\u003e- Clean Module (200 mm)\u003cbr\u003e- DI-Water Dispense Line for Fully Automated Systems\u003cbr\u003e- Bypass DI-Water System\u003cbr\u003e- Spinner Chuck for 100 mm – 200 mm Wafers\u003cbr\u003e- Jet Nozzle\u003cbr\u003e- Center DI-Water Dispense Line\u003cbr\u003e- Chemistry Line 1\/4„\u003cbr\u003e- Digital Flow Meter for 1\/4\" Tubing\u003cbr\u003e- Nitrogen Drying Nozzle on Dispense Arm\u003cbr\u003e- Cleaning capability with chemistry consisting of Chemistry Line 1\/4„\u003cbr\u003e- Digital Flow Meter for 1\/4\" Tubing\u003cbr\u003e- Ionizer Bar for one Process Module\u003cbr\u003e- LowTempPlasma Activation Module\u003cbr\u003e- LowTemp Plasma Activated Bonding License (ex-situ)\u003cbr\u003e- Process Gas Manifold for Four (4) Gas Lines \u003cbr\u003e- Mass Flow Controller 50 sccm\u003cbr\u003e- Mass Flow Controller 2000 sccm \u003cbr\u003e- Vacuum System \u003cbr\u003e- High Frequency RF Generator with Matching Unit\u003cbr\u003e- Low Frequency RF Generator with Matching Unit\u003cbr\u003e- Turbo Molecular Pump \u003cbr\u003e- Chamber Coating for Metal Ion Free Activation\u003cbr\u003e- Ex Situ Plasma Activation Chuck for up to 200 mm Wafers\u003cbr\u003e- Focus Ring for 200 mm Wafers\u003cbr\u003e- Offline Recipe Editor\u003cbr\u003e- Offline Recorder\u003cbr\u003e- Toolbox Basic prepared\u003cbr\u003eWafer Setup:\u003cbr\u003e- Silicon\u003cbr\u003e- Round, Notched\u003cbr\u003e- Thickness: 300 μm - 800 μm\u003cbr\u003eFunction:\u003cbr\u003e- For mechanically aligned SOI and direct wafer bonding with LowTemp plasma activation\u003cbr\u003e- All essential steps for fusion bonding – from cleaning, plasma activation to pre-bonding and IR-inspection – are combined","brand":"Bridge Tronic Global","offers":[{"title":"Default Title","offer_id":44876600901822,"sku":"129130","price":0.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0651\/6175\/6862\/files\/4_9221b024-086c-44fc-b0b7-2bcb5e73f18b.jpg?v=1740167063","url":"https:\/\/www.bridgetronic.com\/products\/129130","provider":"Bridge Tronic Global","version":"1.0","type":"link"}