Karl Suss FC 150 Flip Chip Bonder
Asset # :
69491
Equipment Make:
Karl Suss
Equipment Model:
FC 150
Type:
Flip Chip Bonder
Wafer Size:
Equipment Configuration:
- 200 kg Bond Pressure
- Heating UBA 100mm 200Kg
- Heating Chuck 100mm
- Automatic Alignment
- Process Recording
- 4” Chip and Substrate Cassettes
- Heating UBA 100mm 200Kg
- Heating Chuck 100mm
- Automatic Alignment
- Process Recording
- 4” Chip and Substrate Cassettes
Equipment Pictures:
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Added: February 10, 2023
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Views: 151