Karl Suss FC 150 Flip Chip Bonder

Asset # : 69447
Equipment Make: Karl Suss
Equipment Model: FC 150
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration: - 50 KG bond pressure
- 20Amps
- 220V, 60Hz
Equipment Pictures:
Karl Suss FC 150 Flip Chip Bonder 69447

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Karl Suss FC 150 Flip Chip Bonder 69447 Image 9

Karl Suss FC 150 Flip Chip Bonder 69447 Image 10

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Ad Details

  • Added: February 8, 2023

  • Views: 416

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