Applied Material SNNF Centura Etch System

Asset # : 65461
Equipment Make: Applied Material
Equipment Model: SNNF Centura
Type: Etch System
Wafer Size:
Equipment Configuration:

– 208 50/60hz Centura Controller
– System Controller
– Narrow body loadlocks 0010-75005
– HP robot with metal blade
– Transfer chamber lift
– Endpoint with four monochromators (not mounted)
– Smoke and water leak detect
– Independent Helium cooling
– Seriplex Gas Panel with top feed exhaust
– Seriplex match control
– Wafer mapping
– Wafer on blade sensors
– Umbilicals
– 4 Chambers
Chamber A:
– DPS R0 Poly, w/1110-01043 Source
– RF match AZX 90
– Dual manometers with .1Torr and 10Torr Heads
– Backside Helium Cooling
– 200mm Cathode
– Osaka TG2003M Turbo
Chamber B:
– Poly Etch: Mark II 3 Piece Chamber
– Mark II Shields
– MxP Magnets
– ESC Cathode
– Phase IV RF Match
– Alcatel 5402 CTS Turbo
Chamber C:
– Poly Etch: Uni-Body Chamber
– MxP Shields
– MxP Magnets
– ESC Cathode
– Phase IV RF Match
– Alcatel 5402 CTS Turbo
Chamber D:
– DPS R1 Metal/Deep Trench Etch
– Source RF Match w/AZX-90 Upgrade
– Dual Manometers with .1Torr and 10Torr Heads
– VAT Throttling Gate Valve
– Heated Pump Stack
– 200mm Cathode SNNF ESC
– Alcatel ATH 1300M Turbo
Chamber E:
– Wafer Orienter
– 200mm Lift Hoop
– 200mm Pedestal
– Laser, & CCD Array
Chamber F
– Wafer Orienter
– 200mm Lift Hoop
– 200mm Pedestal
– Laser
– CCD Array

Equipment Pictures:

Send BTG Message:

Inquire

Ad Details

  • Added: May 13, 2022

  • Views: 36

Description

Tags :