Shinkawa UTC 1000 Wire Bonder

Asset # : 61505
Equipment Make: Shinkawa
Equipment Model: UTC 1000
Type: Wire Bonder
Wafer Size:
Equipment Configuration:

– Bonding method: Ultrasonic thermocompression
– Bonding speed: 67 ms/2mm wire (with loop control). Depends on device conditions
– Bonding wire length: Max 8 mm
– Pattern recognition unit:
– Detection method: Gray scale correlation
– Detection sp

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Ad Details

  • Added: October 8, 2021

  • Views: 77

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