Shinkawa UTC 1000 Wire Bonder
Asset # :
61505
Equipment Make:
Shinkawa
Equipment Model:
UTC 1000
Type:
Wire Bonder
Wafer Size:
Equipment Configuration:
– Bonding method: Ultrasonic thermocompression
– Bonding speed: 67 ms/2mm wire (with loop control). Depends on device conditions
– Bonding wire length: Max 8 mm
– Pattern recognition unit:
– Detection method: Gray scale correlation
– Detection sp
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Added: October 8, 2021
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Views: 77