Shinkawa UTC 1000 Wire Bonder

Asset # : 61504
Equipment Make: Shinkawa
Equipment Model: UTC 1000
Type: Wire Bonder
Wafer Size:
Equipment Configuration:

– Bonding method: Ultrasonic thermocompression
– Bonding speed: 67 ms/2mm wire (with loop control). Depends on device conditions
– Bonding wire length: Max 8 mm
– Pattern recognition unit:
– Detection method: Gray scale correlation
– Detection speed: 0.11 s max. / 2-point alignment (including move time)
– Bonding area: X: 28mm / Y: 33mm
– Number of bonding wires: Max 8000 wires
– Applicable lead frame dims:
– Width: 20 ~ 80 mm
– Length: 95 ~ 262 mm
– Thickness: 0.07 ~ 0.3 mm
– Loader / unloader: Magazine stacker type
– Indexer: Center-parting type universal indexer
– Power supply: AC 100 V 5 % 50/60 Hz
– Power consumption: Approx. 1000 W
– Compressed air: 500 kPa{5 kgf / cm2} 60 I/min
– Vacuum pressure: -74 kPa{-550 mmHg} or less (Gauge pressure)

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  • Added: October 8, 2021

  • Views: 10

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