Datacon 8800 Chameo Bonder Sold

– Non functional
– Vision system:
a) Substrate camera: FOV 7.7 x 5.8mm (10.3um/pixel)
b) Uplook camera: FOV 2.0 x 1.5mm (2.6um/pixel)
– Carrier size: 12″ (310mm)
– Base wafer size: 8″ and 12″ wafer taped in same ring frame (376mm x 380mm)
– Multi c