Datacon 8800 Chameo Bonder

Asset # : 61045
Equipment Make: Datacon
Equipment Model: 8800 Chameo
Type: Bonder
Wafer Size: 8", 12"
Equipment Configuration:

– Non functional
– Vision system:
a) Substrate camera: FOV 7.7 x 5.8mm (10.3um/pixel)
b) Uplook camera: FOV 2.0 x 1.5mm (2.6um/pixel)
– Carrier size: 12″ (310mm)
– Base wafer size: 8″ and 12″ wafer taped in same ring frame (376mm x 380mm)
– Multi chip (yes)
– UPH (no dipping): Up to 6000 UPH (depends on die size and number of die per package)
– Face Down
– Known defective parts: 1. Flipper assembly for the left and right gantry 2. CAN driver for the lifter 3. Drivers board for the gantry Z axis, X axis and Y axis 4. Force control board for bond head

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  • Added: September 1, 2021

  • Views: 15

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